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d a t a sh eet product speci?cation supersedes data of 2000 may 02 2002 may 23 integrated circuits sl1ics3001 i-code1 label ic
2002 may 23 2 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 contents 1 features 2 applications 3 general description 4 ordering information 5 block diagram 6 pinning 7 functional description 7.1 general 7.2 memory organization 7.2.1 serial number 7.2.2 write access conditions 7.2.3 special functions 7.2.4 family code and application identifier 7.2.5 user data 8 limiting values 9 quality assurance 9.1 electrical acceptance test 9.2 visual inspection 9.2.1 after wafer final test 9.2.2 after sawing (film frame carrier) 10 handling instructions 11 electrical characteristics 12 mechanical characteristics 12.1 die specifications 12.2 wafer specifications 13 application information 13.1 protection against visible light 13.2 protection against uv light 13.3 resistance to x-rays 13.4 characterisation of inlet and label 13.5 final test of the inlet and label 13.6 coil specification 14 delivery 14.1 configuration of delivered ics 14.2 packing 14.3 documentation 14.3.1 delivery documentation 14.3.2 fail-die identification 14.3.3 wafer mapping 15 reference documents 16 data sheet status 17 definitions 18 disclaimers
2002 may 23 3 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 1 features operating frequency of 13.56 mhz 512-bit read/write memory operating range up to 1.5 m with electronic article surveillance (eas) detection and up to 1.2 m for memory read and write anticollision: simultaneous operation of several labels reliable eas detection avoids false alarms data retention of 10 years operating temperature from - 25 to +70 c in accordance with standards of the federal communications commission (fcc 15 part 3) and european telecommunications standards institute (etsi en 300 330 and en 300 683) open communication protocol application identifier saves time. 2 applications i-code (1) system labels. 3 general description the i-code1 label ic is a dedicated chip for intelligent label applications for logistics and retail (including eas) and for baggage and parcel identification in airline business and mail services. the i-code system offers the possibility of operating labels simultaneously in the field of the reader antenna (anticollision). it is designed for long range applications. whenever connected to a very simple and cheap type of antenna (due to the 13.56 mhz carrier frequency) made out of a few windings printed, wound, etched or punched coil, the sl1ics3001 operates without line of sight up to a distance of 1.5 m (gate width). (1) i-code - is a trademark of koninklijke philips electronics n.v. 4 ordering information type number package name description version sl1ics3001u wafer unsawn wafer; 150 m m; inked and mapped - sl1ics3001w wafer sawn wafer on foil (ffc); 150 m m; inked and mapped -
2002 may 23 4 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 5 block diagram handbook, full pagewidth mgw339 demodulator anticollision read/write control access control eeprom interface control rf interface control la lb test vss analog rf interface digital control sl1ics3001 vdd clock data in data out power supply clock eeprom 512 bits modulator c res fig.1 block diagram. 6 pinning symbol description la bond pad for antenna coil connection a lb bond pad for antenna coil connection b test test pad; this test pad is electrically neutral at sawn wafers vss electrical connection of the substrate pad; the pad is electrically neutral at sawn wafers handbook, halfpage mgw340 lb vss test la fig.2 pad locations.
2002 may 23 5 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 7 functional description this specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on film frame carrier (ffc) of the sl1ics3001 on a philips 6c15 idfw process and is the base for delivery of tested label ics. general recommendations are given for storage, handling, and processing of wafers and for the assembly of labels. this product specification is valid for vcol1v0 from mask revision p/b upwards. 7.1 general the label requires no internal power supply (see fig.1). its contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the reader. the interface also demodulates data which is transmitted from the reader to the label ic, and modulates the electromagnetic field for data transmission from the label ic to the reader. data is stored in a non-volatile memory (eeprom). 7.2 memory organization the eeprom has a memory capacity of 512 bits and is organised in 16 blocks consisting of 4 bytes each (see table 1). a block is the smallest access unit. each block consists of 4 bytes (1 block = 32 bits). bit 0 in each byte represents the least significant bit (lsb) and bit 7 the most significant bit (msb), respectively. the higher 12 blocks contain user data and the lowest 4 blocks contain the serial number, the write access conditions and some configuration bits. the values (in hexadecimal notation) are stored in the eeprom after the wafer production process. the contents of blocks marked with x in table 1 are not defined at delivery. table 1 eeprom memory organization block number byte 0 byte 1 byte 2 byte 3 function 0 snr0 snr1 snr2 snr3 serial number (lower bytes) 1 snr4 snr5 snr6 snr7 serial number (higher bytes) 2 f0 ff ff ff write access conditions 3xxxx special functions (eas and quiet) 4xx x x family code, application identi?er and user data 5 x x x x user data 6 x x x x user data 7 x x x x user data 8 x x x x user data 9 x x x x user data 10 x x x x user data 11 x x x x user data 12 x x x x user data 13 x x x x user data 14 x x x x user data 15 x x x x user data
2002 may 23 6 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 7.2.1 s erial number the unique 64-bit serial number is stored in blocks 0 and 1 and is programmed during the production process. byte snr0 in the table represents the least significant byte and byte snr7 the most significant byte, respectively. table 2 block 0 with serial number (lower bytes) table 3 block 1 with serial number (higher bytes) 7.2.2 w rite access conditions the write access conditions in block 2 determine the write access for each of the 16 blocks. these bits can only be set to logic 0 (and never be changed to logic 1): therefore, already write protected blocks can never be written to from this moment on. this is also true for block 2. if this block is set into the write protected state by clearing of bits 5 and 4 at byte 0, no further changes in write access conditions are possible. the ones (11) in the 16 pairs of bits have to be cleared together if the corresponding block is wanted to be write protected forever: (11) for write access enabled and (00) for write access disabled. writing of bit pairs (10) or (01) to block 2 is not allowed. remarks: it is extremely important to be particularly careful when clearing the write access bits in block 2, as you can lose write access to all of the blocks in case of a mistake. of course, this feature can be used to put the sl1ic3001 into a hardware write protected state. table 4 block 2 with write access conditions for all blocks byte 0 byte 1 byte 2 byte 3 msb lsb msb lsb msb lsb msb lsb block 0 xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx name snr0 snr1 snr2 snr3 byte 0 byte 1 byte 2 byte 3 msb lsb msb lsb msb lsb msb lsb block 1 xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx name snr4 snr5 snr6 snr7 byte 0 byte 1 byte 2 byte 3 msb lsb msb lsb msb lsb msb lsb block 2 11110000111111111111111111111111 write access for block number 3210765411109815141312
2002 may 23 7 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 7.2.3 s pecial functions the special functions block 3 (see table 5) holds the two bits e (eas mode) and two bits q (quiet mode). the remaining 28 bits (marked x) are reserved for future use. if the electronic article surveillance mode is active (bits ee = 11), then the label answers at an eas command. if the quiet mode is enabled (setting bits qq = 11), then the label is permanently disabled but can be activated again with the command reset quiet bit. the label can be activated also by disabling the quiet mode by setting bits qq = 00. the state of the quiet mode does not influence the functionality of the eas command. writing of bit pairs 10 or 01 to block 3 is not allowed. remarks: changing of the write access control or configuration must be done in a secure environment by reading the current value of the block and masking in the new values for bit positions that may be changed. the label must not be moved out of the communication field of the antenna during writing! we recommend to put the label close to the antenna and not to remove it during operation. table 5 block 3 with special functions 7.2.4 f amily code and application identifier the i-code system offers the feature to use (independently) family codes and/or application identifiers with some reader commands. this allows for example the creation of label families. these two 8-bit values are located at the beginning of block 4 and are only evaluated if the bytes at the reader commands are unequal to zero. only if both corresponding parameter bytes at the reader commands anticollision/select, eas and unselected read respectively, are set to logic 0, then block 4 can be used for user data without restriction. bytes 2 and 3 are for customer usage. table 6 block 4 with family code and application id 7.2.5 u ser data the remaining blocks 5 to 15 are for customer usage. byte 0 byte 1 byte 2 byte 3 msb lsb msb lsb msb lsb msb lsb block 3 x x x x q q e e x x x x x x x x x x x x x x x x x x x x x x x x name not used quiet eas not used not used not used byte 0 byte 1 byte 2 byte 3 msb lsb msb lsb msb lsb msb lsb block 4 xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx name family code application id user data user data
2002 may 23 8 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 8 limiting values in accordance with the absolute maximum rating system (iec 60134); notes 1 and 2. notes 1. stresses above those listed in this table may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any conditions other than those described in chapter 11 is not implied. 2. this product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. 3. human body model (hbm) in accordance with mil-std-883d method 3015.7 . symbol parameter conditions min. typ. max. unit t stg storage temperature - 55 - +140 c t j junction temperature - 55 - +140 c v esd electrostatic discharge voltage note 3 - 2 -+ 2kv i i(la-lb)(p) input current (peak value) - 60 -+ 60 ma 9 quality assurance 9.1 electrical acceptance test the electrical acceptance test is performed in line (sampling on the fly) according to the test specifications. sampling plan: according to document general quality specification . 9.2 visual inspection 9.2.1 a fter wafer final test performed according to document snw-fq-627 . sampling plan: according to document general quality specification . 9.2.2 a fter sawing ( film frame carrier ) performed according to document pictoh-qs007. sampling plan (3 wafers per lot): accept 0 to 3. 10 handling instructions please refer to philips general specification for 6 wafer for the following items: sawing die attach wire bonding.
2002 may 23 9 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 11 electrical characteristics t amb = - 25 to +70 c; unless otherwise speci?ed. notes 1. typical ratings are not guaranteed. these values listed are at t amb =25 c. 2. including losses in resonant capacitor and rectifier. 3. measured with an hp4285a lcr meter at 13.56 mhz. 4. the voltage between pads la and lb is limited by the on-chip voltage limitation circuitry, corresponding to parameter i i(la-lb) . symbol parameter conditions min. typ. (1) max. unit general t amb ambient temperature - 25 - +70 c t j junction temperature - 25 - +85 c supply p min minimum operating power v la-lb = 2 v (rms); note 2 - 200 -m w inputs c res capacitance between pads la and lb v la-lb = 2 v (rms); note 3 22.3 23.5 24.7 pf r mod modulator-on resistance i la-lb = 30 ma 50 115 250 w i i(la-lb)(rms) input current (rms value) -- 30 ma ? v i(la-lb)(p) ? minimum input voltage (peak value) standard mode; note 4 read and eas - 3.1 3.7 v write - 3.6 4.1 v fast mode; note 4; read, eas and write - 5.2 6.5 v modulation m min minimum modulation index of rf voltage for demodulator response note 5 - 10 14 % m max maximum modulation index of rf voltage for demodulator response note 5 30 -- % timing f oper operating frequency note 6 13.553 13.560 13.567 mhz t pw modulation start-pulse length of rf voltage m 3 10%; note 7 standard mode 3.54 5.31 (8) 9.44 m s fast mode 15.34 17.11 (8) 21.24 m s t d demodulator response time m 3 10% 0.1 0.8 2.4 m s eeprom t ret eeprom data retention time t amb 55 c10 -- years n write eeprom write endurance 100000 -- cycles
2002 may 23 10 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 5. definition: 6. bandwidth limitation ( 7 khz) according to ism band regulations. 7. the given values are derived from the 13.56 mhz system frequency. 8. recommended values for pulse duration generated at the read/write device. 12 mechanical characteristics 12.1 die speci?cations notes 1. the passivation is a protection of active areas against dust (particles), humidity, and general contamination (whole surface of the chip except for the bond pads). 2. due to the glass-like physical properties careful handling and processing is required. parameter value designation vcol1v0; visible on each die (see fig.3) bond pad location see fig.3 bond pad size: la and lb 130 150 m m test pad size: test and vss 90 90 m m bond pad metallization material alsicu metallization thickness 1.4 m m die dimensions (including 80 m m scribe line) 1460 1490 m m die dimensions (excluding scribe line) 1380 1410 m m tolerances for sawn dies 25 m m pad identi?cation see fig.2 top side passivation material oxynitride; notes 1 and 2 passivation thickness 1.6 m m m v max v min C v max v min + ------------------------------ =
2002 may 23 11 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 mgw341 handbook, full pagewidth 141.4 233.7 1380 1460 (1) 1410 1490 (1) 145 282.1 150 130 lb 90 vss vcol1v0 90 139.7 144.7 150 130 96.5 582.5 90 test 90 la fig.3 die dimensions. dimensions in m m. (1) including 80 m m scribe line.
2002 may 23 12 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 12.2 wafer speci?cations for further information, please refer to the philips documents: dicing process for thin wafers and general speci?cation for 6 wafer . in case of doubt or inconsistency the mentioned wafer speci?cations are applicable. notes 1. wafers can be delivered with a thickness of 525 m m (untreated) or with 150 5 m m (approximately 6 mil) ground and etched backside. 2. there are two wafer status: unsawn and sawn on fcc; both tested. minimum yield per lot is 30%. parameter value designation each wafer is laser scribed with batch and wafer number wafer diameter 150 0.3 mm (150 mm = 6) die separation lane width 80 m m (scribe line) electrical connection of substrate vss potential geometrically complete dies per wafer approximately 7400 orientation of dies relatively to wafer ?at see fig.5 position of test structures see fig.5 wafer layout see fig.5 batch size 24 wafers process 6c15 idfw backside treatment note 1 wafer status note 2
2002 may 23 13 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 mgw342 handbook, full pagewidth 13.41 13.14 fig.4 cluster plan. dimensions in mm.
2002 may 23 14 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 handbook, full pagewidth mgw358 fig.5 cluster map. dimensions in mm. the three black areas show the position of the process control module (pcm) structures on the 6 inch wafer.
2002 may 23 15 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 13 application information 13.1 protection against visible light as a result of the ultra low power design of the sl1ics3001 some analog circuits on the chip are light sensitive. this means that common sunlight can impact the operation of the label if the chip is not protected against visible light radiation. measurements have shown that a maximum radiation of e = 60 w/m 2 (spectrum: 400 to 1000 nm) causes a reduced operating range of the plain chip. measurements of direct sunlight in summer deliver values up to 260 w/m 2 . to ensure proper operation an expected minimum radiation reduction factor of approximately 2 = 8.7 (round 9) must be provided by the encapsulation. that means special care has to be taken to ensure a sufficient light protection of the sl1ics3001 (e.g. non translucent encapsulation or underfiller) according to application requirements. 13.2 protection against uv light an eeprom memory, as used in the sl1ics3001, has some principle sensitivity to uv light (applies to eeprom technology in general). thus strong uv light exposure in the production of inlets or labels has to be avoided. uv light protection has to be ensured using appropriate assembly methods. 13.3 resistance to x-rays x-ray exposure on comparable philips ics (with even smaller feature size) caused neither a long term influence on the behaviour of the ics nor on the data retention of the eeproms. 13.4 characterisation of inlet and label the parameters recommended to be characterised for the inlet and label are given in table 7. 13.5 final test of the inlet and label basic flow for production and test: production of wafer testing of dies on wafer writing of serial numbers and pre-configuration sawing of wafer assembly of inlets and labels final test of inlets and labels writing of customer data. to detect damage of eeprom cells during production of inlets and labels a final test of the eeprom after assembly of the inlet or label is recommended. this is necessary to achieve lowest failure rates. 13.6 coil speci?cation the sl1ics3001 has to be connected at pads la and lb to a coil characterised by its electrical parameters according to philips application note sl1ics3001 i-code1 label ic, coil design guide . 260 60 --------- - table 7 inlet and label parameters note 1. if no command is transmitted to the inlet or label, then the label generates no response and there is no modulation. symbol parameter conditions f res resonant frequency at t amb =22 c and h th ; note 1 h th threshold value for the ?eld strength for command unselected read (standard mode) command unselected read is ok h wr threshold value for the ?eld strength for command write (standard mode) command write (and verifying read) is ok
2002 may 23 16 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 14 delivery 14.1 con?guration of delivered ics the sl1ics3001 is delivered with the following configuration by philips: serial number is unique and read only write access conditions allow to change all blocks (with the exception of both serial number blocks) status of the eas mode is not defined status of the quiet mode is not defined family code and application identifier are not defined user data memory is not defined. remark: as the status of the quiet mode is not defined at delivery, the first command to be executed on the sl1ics3001 should be the command reset quiet bit. 14.2 packing the packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and electrostatic discharge. the packing of unsawn wafers or sawn wafers is done according to philips general specification for 6" wafer . 14.3 documentation 14.3.1 d elivery documentation each wafer container and each larger shipment container is individually marked with the identification information as follows. diffusion batch number (wafer lot number) part designation (type) with revision number ordering code date code of lot acceptance good die quantity. the print out of the final test results is attached to the packing and contains the good die quantity related to every wafer number. 14.3.2 f ail - die identification every die is electrically tested according to the data sheet. identification of the chips which do not confirm with the electrical parameters of the data sheet is done by inking and/or wafer mapping (all dies at wafer periphery are identified by fail). 14.3.3 w afer mapping wafer mapping for failed die identification is available on floppy-disk (format 3.5, electroglas esc-ascend). remark: the wafer map refers to unsawn wafers. at sawn wafers (on ffc) additional ics might be inked (marked as fail) if damaged during the sawing process (compared to wafer map). see fig.6 for an example of the screen shot of a wafer map.
2002 may 23 17 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 handbook, full pagewidth mgw359 fig.6 screen shot of wafer map.
2002 may 23 18 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 table 8 map ?le of this example 15 reference documents electroglas applications - wafer test data file : copyright : ascend :### shortening of the file ### : lot 09397 : 30 device vcol1he2 x40y3 51 product vcol\4020 x41y3 51 wafer 05 x42y3 51 reader 09397-05-b6 x43y3 51 xstep 575 units (0.1)mil x44y3 51 ystep 587 units (0.1)mil x45y3 51 xref 16891 units (0.1)mil x46y3 51 yref -261 units (0.1)mil x47y3 20 xdelta 0 x48y3 20 ydelta 0 x49y3 20 flat 0 x50y3 51 xfrst 21 x51y3 51 yfrst 50 x52y3 51 prquad 1 x53y3 51 coquad 1 x54y3 51 diam 6000 units mil : date 2000-01-23 : time 15:30:00 :### shortening of the file ### operator 4020 : set-up file m:\set\vcol1he2.set : test system sys vcol\4020 edate test data etime probe card pc prober piwp105 category number or title standard mil-std 883d method 3023 standard mil-std-883d method 3015.7 misd standard snw-fq-627 pictoh-qs007 misd standard general quality speci?cation data sheet general speci?cation for 6 wafer application note sl1ics3001 i-code1 label ic, coil design guide application note dicing process for thin wafers
2002 may 23 19 philips semiconductors product speci?cation i-code1 label ic sl1ics3001 16 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. data sheet status (1) product status (2) definitions objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a. 17 definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 18 disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
? koninklijke philips electronics n.v. 2002 sca74 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands 613502/02/pp 20 date of release: 2002 may 23 document order number: 9397 750 08396

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